The partnership covers high-density interconnects, heterogeneous integration and U.S. packaging and test expansion.
Amkor Technology, Inc. announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. Under the agreement, NVIDIA will provide a prepayment to support the expansion of Amkor’s U.S. advanced packaging capacity.
Advanced packaging enables the performance, energy efficiency and system-level integration required for AI infrastructure. NVIDIA and Amkor will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.
Amkor has delivered advanced packaging solutions that support the performance and reliability of NVIDIA platforms across a broad product portfolio, including data center processors, networking chipsets and next generation accelerated computing systems. This expanded collaboration will bring new technologies to market at scale as demand for AI infrastructure grows.
The partnership also reflects a shared commitment to expanding full turnkey advanced packaging and test capabilities in the United States, strengthening domestic semiconductor manufacturing and supply-chain resilience for AI infrastructure. NVIDIA’s capacity agreement supports Amkor’s expansion of U.S. capacity in Arizona, complementing the company’s established manufacturing footprint across Asia, to create a geographically diverse and resilient global supply chain.
Spanning Asia and the United States, the NVIDIA–Amkor collaboration aligns technology development and capacity expansion to support the continued evolution of AI platforms.
